asmc-pxb9-txxxx envisium power plcc-4 surface mount led data sheet features industry standard plcc-4 (plastic leaded chip carrier) high reliability led package mid-power intensity brightness with optimum flux performance using ts alingap dice technologies available in red, red orange and amber colors high optical efficiency higher ambient temperature at the same current possible compared to plcc-2 super wide viewing angle at 120 available in 8 mm carrier tape on 7- inch reel compatible with both ir and ttw soldering process applications interior automotive ?instrument panel backlighting ?central console backlighting ?navigation and audio system ?push button backlighting exterior automotive ?turn signals ?side repeaters ?chmsl ?rear combination lamp ?puddle light electronic signs and signals ?channel lettering ?contour lighting ?indoor variable message sign office automation, home appliances, industrial equipment ?front panel backlighting ?push button backlighting ?display backlighting envisium envisium is the premier class of mid-power leds from agilent and lumileds utilizing the very best solid-state lighting technologies from these two industry leaders. envisium leds offer unparalleled performance, engineering and design flexibility. for the very first time, customers have options for mid-power leds. description the envisium power plcc-4 smt led is an extension of agilents plcc-4 smt leds. the package can be driven at high current due to its superior package design. the product is able to dissipate the heat more efficiently compared to the conventional plcc-2 smt leds. these leds produce higher light output with better flux performance compared to the conventional plcc-4 smt leds. the envisium power plcc-4 smt leds are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. the performance characteristics of these new mid-power leds make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. these leds are compatible with the ir solder reflow process. due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. the envisium power plcc-4 smt led is available in 3 colors, red, red-orange and amber.
2 device selection guide total flux f v test intensity min. i v max. i v (mlm) [2,3] current dice color part number bin (mcd) (mcd) typ. (ma) technology v1 630.00 1000.00 2600.00 red asmc-prb9-tv005 v2 790.00 1260.00 3300.00 50 alingap w1 1000.00 1600.00 - w1 1000.00 1600.00 4300.00 red orange asmc-phb9-tw005 w2 1200.00 2020.00 5000.00 50 alingap x1 1580.00 2500.00 - v1 630.00 1000.00 3000.00 amber asmc-pab9-tv005 v2 790.00 1260.00 3800.00 50 alingap w1 1000.00 1600.00 - notes: 1. the luminous intensity, i v , is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. f v is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 3. flux tested at mono pulse conditions. package dimensions 0.8 0.3 3.5 0.2 2.8 0.2 0.5 0.1 3.2 0.2 2.2 0.2 1.9 0.2 0.1 typ. 0.8 0.1 cathode marking note: all dimensions in mm. ac cc 0.7 0.1
3 absolute maximum ratings (t a = 25 c) parameters asmc-pxb9-txxxx dc forward current [1] 70 ma [3,4] peak forward current [2] 200 ma power dissipation 240 mw reverse voltage 5 v junction temperature 125 c operating temperature -40 c to +100 c storage temperature -40 c to +100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor = 10%, frequency = 1 khz. 3. drive current between 10 ma and 70 ma is recommended for best long-term performance. 4. operation at currents below 5 ma is not recommended. optical characteristics (t a = 25 c) luminous intensity/ peak dominant viewing luminous total flux wavelength wavelength angle 2 q 1 / 2 [2] efficacy h v [3] i v (mcd)/ dice l peak (nm) l d [1] (nm) (degrees) (lm/w) f v [4,5] (lm) color part number technology typ. typ. typ. typ. typ. red asmc-prb9-txxx5 alingap 639.0 630.0 120 155 0.30 red orange asmc-phb9-txxx5 alingap 623.0 617.0 120 263 0.29 amber asmc-pab9-txxx5 alingap 594.0 592.0 120 500 0.26 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the device. 2. q 1 / 2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. radiant intensity, ie in watts/steradian, may be calculated from the equation ie = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efficacy in lumens/watt. 4. f v is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. flux tested at mono pulse conditions. electrical characteristics (t a = 25 c) forward voltage v f (volts) @ i f = 50 ma reverse voltage v r @ 100 a part number typ. max. min. asmc-pxb9-txxx5 2.8 3.4 5 part numbering system asmc - px 1 b9 - tx 2 x 3 x 4 x 5 packaging option color bin selection intensity bin limit intensity bin selection led chip color
4 figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 3. relative intensity vs. forward current. figure 4. maximum forward curren t vs. ambient temperature. derated based on t j max = 125 c, r q ja = 300 c/w. figure 5. radiation pattern. wavelength nm relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 amber 0.6 0.4 0.2 red orange red 0.1 0.3 0.5 0.7 0.9 0 forward voltage v 0 20 70 80 forward current ma 40 10 50 30 60 4 3 12 020 dc forward current ma 0 0.4 relative luminous intensity (normalized at 50 ma) 75 35 45 40 50 55 60 65 70 0.8 0.2 1.0 10 0.6 1.2 25 515 30 1.4 0 80 0 20 60 80 120 maximum forward current ma ambient temperature c 40 50 60 30 40 20 10 70 100 relative intensity 1.0 0 angle degrees 0.8 0.7 0.5 0.3 0.1 0.9 0.6 0.2 0.4 -70 -50 -30 30 50 70 90 -90 -10 10
5 figure 6a. recommended sn-pb reflow soldering profile. 240 c max. 20 sec. max. 3 c/sec. max. 120 sec. max. time temperature 183 c 100-150 c 6 c/sec. max. 60-150 sec. 3 c/sec. max. 217 c max. 120 sec. 6 c/sec. max. 3 c/sec. max. 125 c 25 c 255 c 60 to 150 sec. 10 to 20 sec. time temperature * the time from 25 c to peak temperature = 6 minutes max. +5 c -0 c figure 6b. recommended pb-free reflow soldering profile. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time seconds temperature c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. figure 7. recommended wave soldering profile.
6 figure 9. tape leader and trailer dimensions. figure 8. recommended soldering pad pattern. 0.5 1.1 0.2 8.5 3.4 4.05 4.05 4.05 8.5 3.8 pad clearance pad clearance solder-resist 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ? 180 reel. 960 mm min. for ? 330 reel. c a user feed direction
7 figure 10. tape dimensions. figure 11. reeling orientation. cathode side printed label user feed direction 4 0.1 2 0.05 b b 5.5 0.05 a a 12 +0.3/-0.1 ? 1.5 +0.1/-0 3.6 0.1 3.8 0.1 0.229 0.01 ca cc view b-b view a-a 3.45 0.1 8 0.1 ? 1 +0.1/-0 all dimensions are in millimeers (mm). 1.75 0.1
color bin limits amber/ yellow min. (nm) max. (nm) 1 582.0 584.5 2 584.5 587.0 3 587.0 589.5 4 589.5 592.0 5 592.0 594.5 6 594.5 597.0 red orange min. (nm) max. (nm) 1 611.0 616.0 2 616.0 620.0 red min. (nm) max. (nm) full distribution tolerance of each bin limit = 1 nm. packaging option (x 5 ) option test current package type reel size 5 50 ma top mount 7 inch color bin select (x 4 ) individual reel will contain parts from one full bin only. x 4 0 full distribution a 1 and 2 only b 2 and 3 only c 3 and 4 only d 4 and 5 only e 5 and 6 only g 1, 2 and 3 only h 2, 3 and 4 only j 3, 4 and 5 only k 4, 5 and 6 only m 1, 2, 3 and 4 only n 2, 3, 4 and 5 only p 3, 4, 5 and 6 only r 1, 2, 3, 4, and 5 only s 2, 3, 4, 5 and 6 only intensity bin select (x 2 x 3 ) individual reel will contain parts from one half bin only x 2 min i v bin x 3 0 full distribution 3 3 half bins starting from x 6 1 4 4 half bins starting from x 6 1 5 5 half bins starting from x 6 1 7 3 half bins starting from x 6 2 8 4 half bins starting from x 6 2 9 5 half bins starting from x 6 2 intensity bin limits & typical flux bin id min. (mcd) max. (mcd) v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00 tolerance of each bin limit = 12%. 8
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ?2005 agilent technologies, inc. january 30, 2005 5989-2308en
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